THIN FILMS AND COATINGS

Introduction
Stainless steel films are reactively magnetron sputtered in argon or nitrogen gas flow onto
oxidized silicon wafers using austenitic AISI 316 stainless-steel targets. The use of Nitride is
a preferable coating substance for thin films applications because of its astonishing hardness,
adhesion, and toughness (Bayer and Lee, 2006, p.39-42). The placed films of about 200 nm
thickness of well-cleaned substrates of glass, for example, silicon and stainless steel were
characterized by conversion electron Mö-i; magneto-optical, Bauer spectroscopy, X-ray
diffraction, Kerr-effect, resonant nuclear and reaction analysis. These methods were used for
a comprehensive study and analysis of the nitriding effects for the sputtered stainless-steel
films (Yamashina, 2010, p.19-27). The formation of a nebulous and soft ferromagnetic phase
in a broad range of the processing parameters was found. Further, the influence of post
vacuum-annealing was scrutinized by agitated angular association to attain a complete
understanding of the Nitriding phase formation and process (Yamashina, 2010, p.19-27).
This research study can assist in the expansion and improvement of a duplex plasma
surface restructuring process of plasma nitride coated DSS samples charted by dc pounded
magnetron spluttering of Titanium in the presence of Nitrogen and Argon to form Titanium
Nitride component that is a hard coating.
Magnetron sputtering is a valuable method for thin film deposition because it
enhanced performances of the material due to the high rate of coating, reduced operating
pressures and increased quality of coating substrate (Bayer and Lee, 2006). These established
coverings are much tougher and have improved life span as the subsurface is also plasma
nitride-coated (Yamashina, 2010). Furthermore, it prevents the oxidization and pit
establishment as the set down layer is inactive for any corrosion and more so it has a backup

layer which also does not get eroded easily. This duplex process can be used for a wide
variety of steels substances types (Kaufmann, et al., 2008, p.237-251).

Background

Magnetrons are categories of cold cathode discharge devices that are commonly used
in a diode mode. The plasma is introduced between the cathode and the anode at force in the
motor range by the application of a high voltage, which can be either D.C. A variety of
geometric arrangements gives effective performance such as the long rectangular planar
magnetron, cylindrical magnetron with a post or hollow cathodes, and plasma ring sources.
The most widely used are the planar magnetron, because of the simplicity of target
manufacture (Nender et al., 2011, p. 1534-1538).
Pulsed magnetron sputtering has become an important and the main device for the
deposition of engineering quality thin films and coatings. The process has unlocked the door
and new avenues to the monetary large-scale engineering and development of brand new or
upgraded and enhanced merchandises including flat screen displays, solar cells and solar
panels, solar control coatings and barrier layers on wrapping (Nender et al., 2011, p. 1534-
1538). Pounded magnetron sputtering combines the leads of conventional DC magnetron
sputtering method and RF magnetron sputtering skill. The pulse command gives a better of
stability to the discharge insensitive and reactive gases such as oxygen.
Pulse magnetron sputtering diminishes the substrate temperature due to the reduced
duty cycle while it encourages and increases chemical reaction process on the coated surface
of Silicon or stainless steel. Magnetron sputtering of late has been a trending the process used
by many companies for the installation of a broad range of industrially significant crusts
(Jacquot & Pagny, 2006, p.838-842). For example it comprises hard, wear-resistant coatings,
low to friction coatings, decay resistant coatings, ornamental coatings and others with definite

optical or and electrical features. Even though the straightforward sputtering method has
been in the know and been used for a good number of years, it is good to note that magnetron
development has been since being unbalanced; one in which the magnetic fields of the
opposing magnetic polarity are not equal.
This imbalance in the magnetic field strength can be achieved by either making the
outer ring or inner ring of magnets stronger therefore, its integration into various sources and
closed-field arrangements and organization have been the greatest responsibility for the
amazing rise in significance of this technique.
On the other hand, nitriding of steel samples is one of the most comprehensively used
plasma technologies by industrial companies engaged in the surface micro hardening of
automobile parts of some devices (Baumgärtner and Jehn, H. 2009, p. 108-114).
Titanium nitride coatings provide the appearances of gold with the power of steel.
The covering of watch bezels, drill bits, out-of-doors lighting and window glass and window
panes are various examples of the most widespread uses of these nitrides. Titanium nitride
thin films are commonly used for a range of structural and also in electrical and electronic
applications and devices. The property of hardness of these coatings makes them the best and
appropriate choices for wear resilient applications and the glistening golden yellow colour
makes the type very eye-catching for embellished applications. With such a wide range of
applications of these alloys, it becomes increasingly imperative to explain and quantify the
effects processing parameters have on the development and properties of titanium nitride and
identified new uses of the consequential products.
Moreover, the excellent electrical conductivity of titanium nitride joint with the fact
that it is a noble diffusion barrier make it an ultimate contact substance in the
microelectronics industry (Baumgärtner and Jehn, H. 2009, p. 108-114). Research on thin

films based on Titanium Nitride has been done for a period of at least 25 years, the main or
the driving emphasis being on tuning the anticipated properties of this product, such as
hardness, adhesion and electrical resistivity, for an identified applications. The most normally
used practice for the deposition of Titanium Nitride thin films seems to be responsive or
reactive sputtering from an elemental Titanium target by a sputtering gas component
consisting of Argon and Nitrogen elements (Zegarski and Giorlami, 2015, p.3603-3609).
According to Sinha (2012, p.590-595), The recent advances in magnetron sputtering
gives room for very high-performance coatings. Without a doubt, in most of the applications,
magnetron sputtered coatings currently outdo coatings produced by other methods.
Magnetron sputtering is a kind of physical vapour deposition (PVD) process (Senna, et al.,
2010). PVD coated tool can give an increase in life span as compared with an uncoated tool
of up to 20 times, paralleled to the 2- 5 times increase in life span that other techniques are
able to give. In the case of tough coatings, there is the deficiency of loadbearing help and
support delivered by the substrate component; while, in the case of decay resistant coatings,
pinhole faults have found the middle ground for the performance of the coating (Sinha, 2012,
p.590-595). To find solutions for these problems and defects, and ensure an extended
commercial viability of advanced PVD progressions, duplex surface engineering activities
have been established and advanced lately (Senna, et al., 2010).
Duplex surface engineering as the sequential application of two or more established
surface technologies to yield a surface composite with their pooled properties which cannot
be produced through any different surface technology (Gudowska, 2014, p.733-736). The
duplex process which is essentially the magnetron sputtering of pre-nitride covered steel, in
which the some different processes complement one another and the collective effects is
derived from each of the two processes. Plasma nitriding yields a comparatively thick of
about 700 µm, quite hardened to approximately about 15 Gpa coated subsurface. A 50 µm

dense titanium nitride layer surface can consequently be deposited against the nitride coated
surface using a number of PVD techniques, which among them is the magnetron sputtering.
Components processed in this type have the high wear impervious, great load-bearing
capacity and high weakness strength characteristics of the nitride covered layer (Gudowska,
2014, p.733-736).
To analyse nitride coated and sputtered surfaces, description techniques such as Field
Emission Scanning Electron Microscope, contact Angle measurement and the scratch testing,
micro hardness, corrosive tests and X-ray diffraction are extensively used and are correlated
with process parameters to optimize the progression (Cheng, 2007, p. 371-384). Observations
that can be seen are grains of globe shape and columnar morphology being formed and films
being hydrophilic in nature. To attain an overall picture and the understandings of the
evolution of dispersion layer or coating layer structure within the deposition time and a
substrate coated material, several aspects of X-Ray Diffraction would be exploited efficiently
(Cheng, 2007, p. 371-384).

References

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